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Reexamination of the solder ball shear test for evaluation of the mechanical joint strength - ScienceDirect
High Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
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Metals | Free Full-Text | Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition | HTML
High Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
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